Wi-Fi chipset market is expected to gain market growth in the forecast period of 2021 to 2028. Data Bridge Market Research analyses the Wi-Fi chipset market to exhibit a CAGR of 4.0% for the forecast
Asia-Pacific Wi-Fi Chipset Market Scope and Market Size
- On the basis of device, the market is segmented into tablet, connected home devices, smartphones, PCs, access point equipment and others.
- On the basis of band, the market is segmented into single band, dual band and tri band.
- On the basis of fabrication technology, the market is segmented into FinFET, FDSOI CMOS, silicon on insulator (SOI) and sige.
- On the basis of WI-FI standard, the market is segmented into 802.11AY, 802.11AD, 802.11AX, 802.11AC, WAVE 1, 802.11AC, WAVE 2, 802.11B, 802.11G and 802.11N.
- On the basis of die size, the market is segmented into 28nm, 20nm, 14nm, 10nm and others.
- On the basis of MIMO configuration, the market is segmented into SU-MIMO, MU-MIMO, 1X1 MU-MIMO, 2X2 MU-MIMO, 3X3 MU-MIMO, 4X4 MU-MIMO, and 8X8 MU-MIMO.
- On the basis of end user, the market is segmented into consumer, automotive and transportation, healthcare, education, BFSI, travel and hospitality and others.
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Wi-Fi Chipset Market Country Level Analysis
The countries covered in the Wi-Fi chipset market report China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines and rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC).
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Competitive Landscape and Wi-Fi Chipset Market Share Analysis
The Wi-Fi chipset market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, Asia-Pacific presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to Wi-Fi chipset market.
Major Key Player Asia-Pacific Wi-Fi Chipset Market
The major players covered in the Wi-Fi chipset market report are Intel Corporation, Qualcomm Technologies. Inc., Sony Semiconductor Israel Ltd, ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD, Broadcom, Hitachi Vantara Corporation, Cisco Systems, Inc., Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics, MediaTek Inc., Cypress Semiconductor Corporation, PERASO TECHNOLOGIES INC., PERASO TECHNOLOGIES INC, Semiconductor Components Industries, LLC, Cypress Semiconductor Corporation and Texas Instruments Incorporated among others. DBMR analysts understand competitive strengths and provide competitive analysis for each competitor separately.
MAJOR TOC OF THE REPORT
Ø Chapter One: Introduction
Ø Chapter Two: Market Scope
Ø Chapter Three: Regional Analysis
Ø Chapter Four: Market Share Analysis
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BROWSE RELATED REPORTS
Asia-Pacific Wi-Fi Chipset Market - Industry Trends and Forecast to 2028
Europe Wi-Fi Chipset Market - Industry Trends and Forecast to 2028
Middle East and Africa Wi-Fi Chipset Market - Industry Trends and Forecast to 2028
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